The goal of this workshop is to collect, align and discuss inputs to the definition of priority-topics as a basis for the discussion on priorities in the Work Programme for the first KDT call. This workshop specifically addresses system integration topics as identified by the ECS community, and described in the various sections of the ECS SRIA 2021. Inputs on priorities in this field will be given by the ECS community a representative of the Integrated Photonics and of the Flexible Electronics community, and also be given from the public side by experts of the European Commission and the member states.
A major ECS technology trend is the multifunctional integration of microelectronics, MEMS and photonics into sensor systems with processing and communication capabilities. Advanced heterogeneous integration and packaging solutions for System-on-Chip (SoC), 2.5 and 3D stacking (incl. chiplet technology), smart System-in-Package (SiP), sensor integration, and new functionalities will be required for many application domains. The co-design of the integration solutions will be important to develop systems with advanced functionalities. Integration platforms for new areas of application will drive major innovations in portable and wearable personal devices (e.g. for health monitoring), 5G and 6G communications, data centres, autonomous vehicles, food safety and environmental monitoring and many others.
The roadmap document ECS-SRIA describes technological developments for the next years in Section 1.1 and Section 1.2 mainly. Specific integration aspects rising from the different application areas are addressed in sections 3.1 to 3.6. Besides cross-sectional topics addressed in sections 2.1 - 2.4 (e.g. with regard to AI, connectivity, design of systems, their reliability, safety and security) will play a big role in future to achieve full functionality, reliability, safety and security of multifunctional systems in the future.
The key contributors of the topic to the SRIA give an overview/explanation and propose initial priorities. Then the EC and representatives of Participating States (PS) give their viewpoints, followed by contributions of representatives of other stakeholders and the European ECS industries with overlapping interests. Then a general discussion is planned with all speakers. Participants can provide input during the workshop.
|09.30||Welcome||Werner Steinhögl, European Commission and Wolfgang Geßner, EPoSS|
|09.35||Introduction by moderator||Elisabeth Steimetz, VDI/VDE-IT|
|09.40||Overview and priority proposals in the ECS-SRIA 2021||Luis Fonseca, IMB-CNM (CSIC) and Pekka Pursula, VTT|
|10.00||Member state representatives panel|
|10.20||Portfolio analysis on the topic in ECSEL JU programme||Yves Gigase, ECSEL JU|
|10.30||Priority research topics from the perspective of hybrid, flexible and printed electronics||Ralf Zichner, Fraunhofer ENAS|
|10.40||Priority research topics from the perspective of silicon photonics||Roel Baets, ePIXfab, Ghent University and Imec|
|10.50||Packaging makes the difference||Klaus Pressel, Infineon|
|11.00||How AR , edge AI and advanced MEMS enable breathtaking new applications||Matthias Illing, Bosch|
|11.10||Speakers discussion||Led by Elisabeth Steimetz VDI/VDE-IT|
|11.40||Collecting input from the audience|
|12.00||Wrap-up of workshop discussion||Elisabeth Steimetz, VDI/VDE-IT|
|12.30||Closing words||European Commission and Wolfgang Geßner , EPoSS|
The workshop will be open to all contributors to the ECS SRIA 2021 and the members of AENEAS, ARTEMIS-IA, EPoSS, Photonics 21 and OE-A.
For a report of the workshop a writer/rapporteur will be hired. The report is planned to be available to the participants and the shadow KDT Governing Board by mid of June.