ECS-SRIA workshops

Multifunctional integration including Integrated Photonics and flexible electronics

The goal of this workshop is to collect, align and discuss inputs to the definition of priority-topics as a basis for the discussion on priorities in the Work Programme for the first KDT call. This workshop specifically addresses system integration topics as identified by the ECS community, and described in the various sections of the ECS SRIA 2021. Inputs on priorities in this field will be given by the ECS community a representative of the Integrated Photonics and of the Flexible Electronics community, and also be given from the public side by experts of the European Commission and the member states.


A major ECS technology trend is the multifunctional integration of microelectronics, MEMS  and photonics into sensor systems with processing and communication capabilities. Advanced heterogeneous integration and packaging solutions for System-on-Chip (SoC), 2.5 and 3D stacking (incl. chiplet technology), smart System-in-Package (SiP), sensor integration, and new functionalities will be required for many application domains. The co-design of the integration solutions will be important to develop systems with advanced functionalities. Integration platforms for new areas of application will drive major innovations in portable and wearable personal devices (e.g. for health monitoring), 5G and 6G communications, data centres, autonomous vehicles, food safety and environmental monitoring and many others.

The roadmap document ECS-SRIA[1] describes technological developments for the next years  in Section 1.1 and Section 1.2 mainly. Specific integration aspects rising from the different application areas are addressed in sections 3.1 to 3.6. Besides cross-sectional topics addressed in sections 2.1 - 2.4 (e.g. with regard to AI, connectivity, design of systems, their reliability, safety and security) will play a big role in future to achieve full functionality, reliability, safety and security of multifunctional systems in the future.  


The key contributors of the topic to the SRIA give an overview/explanation and propose initial priorities. Then the EC and representatives of Participating States (PS) give their viewpoints, followed by contributions of representatives of other stakeholders and  the European ECS industries with overlapping interests. Then a general discussion is planned with all speakers. Participants can provide input during the workshop.




Download the presentation slides in the programme.




09.30 Welcome Werner Steinhögl, European Commission and Wolfgang Geßner, EPoSS
09.35 Introduction by moderator Elisabeth Steimetz, VDI/VDE-IT
09.40 Overview and priority proposals in the ECS-SRIA 2021 Luis Fonseca, IMB-CNM (CSIC) and Pekka Pursula, VTT

Viewpoints of the European Commission and Member states & discussion
Viewpoints of European Commission
Viewpoints of Germany

Member state representatives panel
10.20 Portfolio analysis on the topic in ECSEL JU programme Yves Gigase, ECSEL JU
10.30 Priority research topics from the perspective of hybrid, flexible and printed electronics Ralf Zichner, Fraunhofer ENAS
10.40 Priority research topics from the perspective of silicon photonics Roel Baets, ePIXfab, Ghent University and Imec
10.50 Packaging makes the difference Klaus Pressel, Infineon
11.00 How AR , edge AI and advanced MEMS enable breathtaking new applications Matthias Illing, Bosch
11.10 Speakers discussion Led by Elisabeth Steimetz VDI/VDE-IT
11.30 Break
11.40 Collecting input from the audience
12.00 Wrap-up of workshop discussion Elisabeth Steimetz, VDI/VDE-IT
12.10 Final statements
12.30 Closing words European Commission  and Wolfgang Geßner , EPoSS

The workshop will be open to all contributors to the ECS SRIA 2021 and the members of AENEAS, ARTEMIS-IA, EPoSS, Photonics 21 and OE-A.

For a report of the workshop a writer/rapporteur will be hired. The report is planned to be available to the participants and the shadow KDT Governing Board by mid of June.


Participation to the ECS SRIA workshops is free of charge. Registration is open to all members of the organisers communities and for invited actors in the field of Electronic Components and Systems.